FASTELEK ELECTRICALLY CONDUCTIVE ADHESIVE FILMS
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ELECTRICALLY CONDUCTIVE THERMOPLASTIC FILMS
Fastelek is a customizable heat activated electrically conductive adhesive film product available in different performance fillers, film thicknesses and melt point temperatures. Fastelek is designed to provide an electrica via at the same time conform to a wide range of substrate and interface joints packaged within a custom targeted electrical resistance. Fastelek is an optimal solution for electronic and medical device assembly when either encapsulation, sealing and bonding is required.
As a dry-to-the-touch room temperature free standing adhesive film, Fastelek can be die cut to match a wide range of mounting and sealing application areas. Applications can vary from bonding and/or sealing fasteners or contacts, interface gap filling, encapsulation , bonding components, EMI, or adhering materials through lamination. As a die cut adhesive pad, Fastelek allows for quick and clean “drop-in-place” installation/setup and instantly ready to be heated above its melt point using a wide range of commercially available heat presses.
Fastelek is available as a free standing (unsupported) adhesive film. Optional substrate coating available for different types of metal foil and high performance plastic films.
Fastelek Conductive Adhesive Features and Benefits
- Fully customizable electrical resistance
- Uniform bond line adhesion | sealing
- Range of melt point temperatures (71C to 110C)
- Multiple film thicknesses (0.038mm to 0.76mm)
- Multiple conductive filler options
- Excellent gap filling properties
- Short heat cycle processing
- Prototype and production die cuts
- Roll and die cut reel options
- Inert | no outgassing characteristics (solvent free)
- Quick and clean installation
- Substrate coatings available (films and foils)
- Install with standard or custom heating equipment
- Quick lab draw down prototype film process
Contact us at 1-888-989-3832 or email info@stretech.com to review how Fastelek can fit within your application requirements.
FASTELEK BASE FORMULATION AND FILLER OPTIONS
Fastelek AG
Fully Customizable Adhesive Film
Melt Points: 71C, 93C or 110CFiller System: Silver (AG)
Film Thickness: 0.038mm to 0.76mm
Substrate Coating: Optional
Substrate Coating: 100% surface or discrete substrate placement
Fastelek Ni
Fully Customizable Adhesive FilmMelt Points: 71C, 93C or 110CFiller System: Nickel (Ni)
Film Thickness: 0.038mm to 0.76mmSubstrate Coating: OptionalSubstrate Coating: 100% surface or discrete substrate placement
Film Thickness: 0.038mm to 0.76mmSubstrate Coating: OptionalSubstrate Coating: 100% surface or discrete substrate placement
Fastelek GT
Fully Customizable Adhesive FilmMelt Points: 71C, 93C or 110CFiller System: Graphite
Film Thickness: 0.038mm to 0.76mmSubstrate Coating: OptionalSubstrate Coating: 100% surface or discrete substrate placement
Film Thickness: 0.038mm to 0.76mmSubstrate Coating: OptionalSubstrate Coating: 100% surface or discrete substrate placement
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