TIMTEL Phase Change Thermal Interface Materials are available in a range of pad constructions and configurations to meet a range of electronic device applications. Phase change materials acheive an extremely low thermal resistance throught the use of highly thixotropic compound coatings or films that are designed to flow and wetout the interface surfaces removing air from within the interface as well fill in surface imperfections and voids that may exist. During device operation, the compound changes from its solid state into a liquid state greatly improving thermal transfer from device to sink without worry of run-out or migration typically found in silicone based greases.
Please select from one of the following material types below.