TIMTEL PHASE CHANGE THERMAL INTERFACE MATERIALS
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PHASE CHANGE THERMAL INTERFACE MATERIALS
TIMTEL Phase Change Thermal Interface Materials are available in a range of pad constructions and configurations to meet a range of electronic device applications. Phase change materials acheive an extremely low thermal resistance throught the use of highly thixotropic compound coatings or films that are designed to flow and wetout the interface surfaces removing air from within the interface as well fill in surface imperfections and voids that may exist. During device operation, the compound changes from its solid state into a liquid state greatly improving thermal transfer from device to sink without worry of run-out or migration typically found in silicone based greases.
Please select from one of the following material types below.
Please select from one of the following material types below.
Phase Change Thermal Interface Material Features and Benefits
- Excellent replacement for thermal greases
- Low surface resistance leads to excellent heat transfer
- Drop in place pad solution - simple & clean installation
- Multiple constructions (supported and unsupported)
- Adjusts for flatness and voids upon flow
- Highly thixotropic - prevents run-out
- Silicone-free phase change compound designs
- Non-dielectric and dielectric pad constructions
- Available in a range of substrate coating and film thicknesses
- Available in rolls, sheets, die cut invidiuals or die cut reels
PCM: Phase Change Material
Dielectric Phase Change Films (polyimide film supported)
UltraPhase 60
Substrate: Kapton MT+ (plus) Polyimide60C Phase Change TemperatureThickness: 0.064mm to 0.076mm
DiaPhase 60
Substrate: Kapton MT Polyimide
60C Phase Change Temperature
Thickness: 0.051mm to 0.18mm
DiaPhase 60A (Tack Back)
Substrate: Kapton MT Polyimide
60C Phase Change Temperature
Thickness: 0.051mm to 0.14mm
Non-Dielectric Phase Change Foils (aluminum foil supported)
IntraPhase 50
Substrate: Aluminum Foil50C Phase Change TemperatureThickness: 0.051mm to 0.18mm
IntraPhase 60
Substrate: Aluminum Foil
60C Phase Change Temperature
Thickness: 0.051mm to 0.18mm
ActaPhase 60
Substrate: Aluminum Foil
60C Phase Change Temperature
Thickness: 0.051mm to 0.23mm
Phase Change Thermal Interface Films (unsupported)
M45 PCM Film
Thermal Conductivity: 5.0 W/m-K45C Phase Change TemperatureFilm Thickness: 0.13mm to 0.30mm
Free Standing Phase Change Film
XoPhase 45 PCM Film
Thermal Conductivity: 3.0 W/m-K
45C Phase Change Temperature
Film Thickness: 0.13mm to 0.30mm
Free Standing Phase Change Film
CeraPhase 60 PCM Film
Thermal Conductivity: 1.3 W/m-K
60C Phase Change Temperature
Film Thickness: 0.13mm to 0.30mm
Free Standing Phase Change Film
Electrically Conductive Phase Change (aluminum foil supported)
SilverPhase 50
Substrate: Aluminum Foil50C Phase Change TemperatureThickness: 0.076mm to 0.13mm
Electrically Conductive Material
Volume Resistivity: 2.0 ohm-cm
EMI Phase Change Material Pad (multi-layer)
EMI-Phase 60
Multi-Layer EMI Shielding Pad
Top and Bottom Insulation Layers
Multiple Conductive Insert Types60C Phase Change TemperatureFully Customizable EMI Pad
Multiple Thickness Constructions
Phase Change Coated Heat Spreader Films (graphite supported)
Graphenol PCM
Substrate: Graphenol HS (pyrolytic)In-Plane: 1,500 W/m-K
Thru-Plane: 5.0 W/m-K
50C Phase Change Temperature
Thickness: 0.057mm to 0.095mmNon-Dielectric Pad Solution
IntraGraph PCM
Substrate: IntraGraph HS Film
In-Plane: 140 W/m-K
Thru-Plane: 8.0 W/m-K
50C Phase Change Temperature
Thickness: 0.15mm to 0.30mm
Non-Dielectric Pad Solution
Request Sample or Technical Data Sheet