TIMTEL PHASE CHANGE THERMAL INTERFACE MATERIALS
PHASE CHANGE THERMAL INTERFACE MATERIALS
TIMTEL Phase Change Thermal Interface Materials are available in a range of pad constructions and configurations to meet a range of electronic device applications. Phase change materials acheive an extremely low thermal resistance throught the use of highly thixotropic compound coatings or films that are designed to flow and wetout the interface surfaces removing air from within the interface as well fill in surface imperfections and voids that may exist. During device operation, the compound changes from its solid state into a liquid state greatly improving thermal transfer from device to sink without worry of run-out or migration typically found in silicone based greases.
Please select from one of the following material types below.
Phase Change Thermal Pad Features and Benefits
- Excellent replacement for thermal greases
- Low surface resistance lead to excellent heat transfer
- Drop in place pad solution - simple & clean installation
- Multiple constructions (supported and unsupported)
- Adjusts for flatness and voids upon flow
- Highly thixotropic - prevents run-out
- Silicone-free phase change compound designs
- Non-dielectric and dielectric pad constructions
- Available in a range of substrate coating and film thicknesses
- Available in rolls, sheets, die cut invidiuals or die cut reels
Phase Change Films (unsupported)
M45 PCM Film
Thermal Conductivity: 5.5 W/m-K45C Phase Change TemperatureFilm Thickness: 0.13mm to 0.30mm
XoPhase 45 PCM Film
Thermal Conductivity: 3.0 W/m-K
45C Phase Change Temperature
Film Thickness: 0.13mm to 0.30mm
CeraPhase 60 PCM Film
Thermal Conductivity: 1.3 W/m-K
60C Phase Change Temperature
Film Thickness: 0.13mm to 0.30mm
Dielectric Phase Change Films (polyimide film supported)
UltraPhase 60
Substrate: Kapton MT+ Polyimide
60C Phase Change Temperature
Film Thickness: 0.064mm
DiaPhase 60
Substrate: Kapton MT Polyimide
60C Phase Change Temperature
Film Thickness: 0.051mm to 0.18mm
DiaPhase 60A (Tack Back)
Substrate: Kapton MT Polyimide
60C Phase Change Temperature
Film Thickness: 0.051mm to 0.14mm
Non-Dielectric Phase Change Foils (aluminum foil supported)
IntraPhase 50
Substrate: Aluminum Foil
50C Phase Change Temperature
Film Thickness: 0.051mm to 0.18mm
IntraPhase 60
Substrate: Aluminum Foil
60C Phase Change Temperature
Film Thickness: 0.051mm to 0.18mm
ActaPhase 60
Substrate: Aluminum Foil
60C Phase Change Temperature
Film Thickness: 0.051mm to 0.23mm
Electrically Conductive Phase Change (aluminum foil supported)
SilverPhase 50
Substrate: Aluminum Foil
50C Phase Change Temperature
Film Thickness: 0.076mm to 0.13mm
Volume Resistivity: 2.0 ohm-cm
Phase Change Coated Heat Spreading Graphite Films
Graphenol PCM
Substrate: Graphenol HS (pyrolitic)
ULTRA HIGH PERFORMANCE
In-Plane: 1,500 W/m-K
Thru-Plane: 5.0 W/m-K
50C Phase Change Temperature
Thickness: 0.057mm to 0.065mm
Non-Dielectric Pad Solution
IntraGraph PCM
Substrate: IntraGraph HS Film
In-Plane: 140 W/m-K
Thru-Plane: 8.0 W/m-K
50C Phase Change Temperature
Thickness: 0.15mm to 0.30mm
Non-Dielectric Pad Solution
Request Sample or Technical Data Sheet