FASTELFILM 16071 THERMAL BONDING AND SEALING FILM

FastelFilm 16071 Heat Activated EVA Adhesive Film

FastelFilm 16071 (160F/71C) is designed with slightly higher temperature stability than our lower FastelFilm 15066. FastelFilm 16071 is an EVA based thermoplastic adhesive system available in a wide range of film thicknesses and film delivery formats (rolls, narrow rolls, die cuts).
FastelFilm 16071 is popular within the medical device and diagnostic application market due to its low temperature bonding characteristic allowing engineeres to remain conscience when working with substrates or reagents/biologics that may have heat sensitivity. FastelFilm 16071 can be utilized as an adhesive interface bonding 2 substrates together or as a low melt sealing gasket.
With a flow characteristic that can be controlled with heating, FastelFilm 16071 can be provided in a manual drop-in-place or automated die cut format providing efficient heating cycles as well as no clean-up after heating.
As a dry-to-the-touch adhesive film, FastelFilm 16071 can be die cut to match a wide range of mounting and sealing applications areas. Once the adhesive pad is heated to or past its melt point temperature and cooled, the adhesive is set.
FastelFilm 16071 Features and Benefits
  • Melt point temperature: 71C (low melt design)
  • Maximum continuous operating temperature: 55C
  • EVA thermoplastic adhesive (ethylene vinyl acetate)
  • Non-thermoset adhesive system (reworkable)
  • Inert thermoplastic formulation | solvent free
  • Bond flat and non-flat surfaces
  • Dry film at room temperature (standard)
  • Ideal for bonding ultra heat sensitive substrates or reagents
  • Free standing film available in a range of thicknesses
  • 100% substrate surface coating available (films and foils)
  • Discrete substrate placement capability
  • Drop-in-place dry pad installation | clean adhesive assembly
  • Optional release liner backings (PET film or paper)
  • Optional liner release values (EZ to high release values)
  • Available in rolls, sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
request samples | data sheet

General Specifications

  • Melt point: 160F | 71C (full liquid state)
  • Continuous operating temperature: -20C to 55C (post bonding)
  • Chemistry: EVA thermoplastic (non-thermoset)
  • RoHS | REACH | Halogen Free Compliant
Format: Free standing dry at room temperature thermoplastic adhesive film with release liner.

Standard Cross Section

Standard Film Thickness
  • 0.038mm - 0.0015"
  • 0.08mm - 0.003"
  • 0.13mm - 0.005"
  • 0.25mm - 0.010"
  • 0.38mm - 0.015"
  • 0.51mm - 0.020"
  • 0.76mm - 0.030"
  • Custom film thickness available
Surface Types
  • Dry film surface (standard)
  • TYPE A (low tack repositionable - 0.013mm microsphere PSA lamination on one side of FastelFilm)
  • Differential (barrier substrate film with FastelFilm one side and high strength pressure sensitive adhesive other side)
  • See FastelFilm HPB versions for tack films without the use of lamination.
Release Liner Types
  • White paper release liner
  • Clear PET (polyester) release liner (multiple thicknesses and adhesive film release characteristics available depending on installation requirement)
  • Release liner printing available (2 color)
Delivery Formats
  • Master rolls
  • Custom and Narrow slit rolls
  • Die cut individuals
  • Multiple die cuts per sheet
  • Die cut continuous reels
  • Laser cut (precision tolerance)
Coating & Adhesive Color
  • Free standing film (standard)
  • 100% substrate surface coating
  • Discrete adhesive placement on substrate
  • Translucent yellow (up to 0.13mm)
  • Opaque yellow (0.18mm and up)
  • Custom coloring available
Available Substrates
  • Aluminum foil
  • Copper foil
  • Stainless steel foil
  • Polyimide film
  • Polyester (PET) film
  • Polypropylene film
  • Customer defined substrate

DOE Testing (design of experiment)

When designing a new product, experimenting to determine the suitability of our products within the scope of your applications is key. Fastelfilm can be heated using commercially available or custom heating devices such as heat presses, ovens or heated rollers. Prior to testing FastelFilm, we encourage our customers to perform a DOE (design of experiment) based upon the FastelFilm melt point and substrates being bonded as well as other subsequent application sensitivities that may exist. Since all of our customer applications involve various substrate types, substrate thicknesses and heating devices, we strongly encourage our cusotmers to understand the relationship between your heating device's set temperature and what temperature is yielded at the bond line (area where the FastelFilm resides). Understanding the relationship between set temperature and bondline temperature will significantly help narrow the scope of DOE combinations and shorten your process towards optimization.

Preparation | Installation Guidelines

The following are general guidelines to be used as a preliminary basis to determine suitibility of FastelFilm. The below stated values are to be used as a starting point only and should be further tested to determine optimal heating time, temperature and pressure in order to yield the desired result. Since FastelFilm has no pre-determined heating time beyond heating to or past its melt point, it is important to understand the relationship between heating time, heating temperature and pressure applied during heating in order to optimize installation.
16071 Softening Pont | Max Heating
Softening Point: 55C Melt Point: 71C (full liquid state) In order to acheive continuous temperature stability in field use, softening point should be higher than your device's established maximum operating temperature or higher than any post bonding internal temperature stability testing that may be required. Maximum Processing Heating Temperature FasteFilm 16071 can be heated alongside other materials that require higher heating. Maximum process heating temperature of the FastelFilm 16071 is 150C. Prolonged heating exposure above this temperature may result in adhesive damage.
Surface Preparation
All surfaces should be clean and free debris. Surface can be cleaned with Isopropyl Alcohol (IPA) or solvent. All surfaces should be dry prior to installing adhesive. Additonal surface treatments may be considered depending on substrate material type and application requirements.
CORONA TREATED SURFACES Corona treated surface modification may be a benefit depending on substrate material type. Customer testing required.TEXTURED SURFACES Textured surface may be a benefit in order to create more surface area depending on substrate type. Customer testing required.ADHESION PROMOTERS It is important for customers to determine compatability of adhesive promoter treatment.
Tack Temperature
60C to 70C Liner note: adhesive pad should be handled with carrier liner. Heat through carrier liner to transfer heat. Once cooled, remove liner. Maintain adequate surface contact pressure during this process.
Full Bond Heating Temp
71C to 90C+ Heating temperature stated is at bond line (area where adhesive film resides). Necessary to acheive adequte wet-out of the adhesive onto the substrates. Adhesive should not be exposed to temperatures above 300F / 150C.
Heating Pressure
3 PSI to 100 PSI+ Important to maintain good surface contact of the adhesive to the substrates. No set pressure required. Dependent on substrate type, thickness, interface area as well as substrate durability.
Heating Time
3 seconds to 30 seconds (variable)
No set heating time required. Dependent on thermal conductivity of substrates and heating devices. Minimum melt point must be acheived. No complex ramp up and ramp down patterns required unless other materials require this during the heating process.
Cooling (set) Time
Variable
Adhesive should be allowed to adequately cool below its melt point before applying stress. It is recommended (not required) to maintain pressure during cooling to promote surface contact during this process. Forced direct air systems okay to accelerate cooling.
Re-Work or Clean Up
71C to 90C+ While adhesive remains in its melted open state, disassemble substrates. For re-bonding, it is recommended to clean interface area and apply new adhesive pad. Traditional solvents (biosolvent or mineral spirits) or Isopropyl Alcohol (IPA) can be used to clean adhesive. Slight heat can also be applied to surface adhesive residue and wiped clean while adhesive is in softened state.
Viscosity Note
Fastelfilm is designed with a specific melt point temperature. Flow control within its melted state is a function of heating temperature and pressure. As the adhesive is heated further past its melt point temperature, its viscosity continuously decreases. Significant pressure within a low viscosity state can cause adhesive run-out outside the interface.
Interface Contact
Depending on your heating application setup, an interface pad between the heat source and stack-up may be considered to provide conformability across large interfaces. Soft, mid and hard durometer thermally conductive gap pads can be considered in order to minimize the temperature drop from heat source to bond line (area where Fastelfilm resides).
Heating Equipment
Heating can be acheived through the use of off the shelf heating equipment such as heat presses, ultrasonic welding presses, ovens or heated rollers.
Click here to learn more about our recommended heating equipment partner.
Heat Press and Ultrasonic Welding Equipment

Application Assistance

For further assistance and recommendations for installing and heating FastelFilm, please contact us Toll Free at 1-888-989-3832 (US Only) +1-949-369-7676 (International) or e-mail us at info@stretech.com
Request Sample or Technical Data Sheet
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