FASTELFILM HPA-2500 THERMAL BONDING AND SEALING FILM

FastelFilm HPA-2500 Heat Activated Adhesive Film

FastelFilm HPA-2500 is a polyethylene/synthetic rubber based thermoplastic adhesive film designed to offer excellent bonding performance between a range of plastic and metal substrates at the same time offering inert physical charactersitics post bonding. FastelFilm HPA-2500 can also offer an alternative to applications where EVA compatability issues exist FastelFilm HPA-2500 can be used in applications where substrates can manage the higher heating temperature but require a higher continuous operating temperature. Through its higher operating temperature, it can be considered for more robust electronics, industrial, automotive or medical device/diagnostic applications. FastelFilm HPA-2500 can be utilized as an adhesive interface bonding 2 substrates together or used as an interface perimeter sealing gasket.
As a dry-to-the-touch adhesive film, FastelFilm HPA-2500 can be die cut to match a wide range of mounting and sealing applications areas. Once the adhesive pad is heated to or past its melt point temperature and cooled, the adhesive is set.
FastelFilm HPA-2500 Features and Benefits
  • Melt point temperature: 120C (low viscosity @ melt)
  • Maximum continuous operating temperature: 80C
  • PE / synthetic rubber thermoplastic adhesive
  • Inert thermoplastic formulation | solvent free
  • HPA-2500 (dry at room temperature film surface)
  • HPA-2500-PT (tacky at room temperature film surface)
  • Bond flat and non-flat surfaces
  • Dry film at room temperature (standard)
  • Ideal for bonding heat sensitive substrates or reagents
  • Free standing film available in a range of thicknesses
  • 100% substrate surface coating available (films and foils)
  • Discrete substrate placement capability
  • Drop-in-place dry pad installation | clean adhesive assembly
  • Optional release liner backings (PET film or paper)
  • Optional liner release values (EZ to high release values)
  • Available in rolls, sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
request samples | data sheet

General Specifications

  • Melt point: 250F | 120C (full liquid state)
  • Continuous operating temperature: -30C to 80C (post bonding)
  • Chemistry: PE / synthetic rubber themroplastic
  • RoHS | REACH | Halogen Free Compliant
Format: Free standing film or tacky film at room temperature thermoplastic adhesive film with release liner.

Standard Cross Section

Standard Film Thickness
  • 0.038mm - 0.0015"
  • 0.08mm - 0.003"
  • 0.13mm - 0.005"
  • 0.25mm - 0.010"
  • 0.38mm - 0.015"
  • 0.51mm - 0.020"
  • Custom film thickness available
Surface Types
  • HPA-2500: Dry Film
  • HPA-2500-PT: Tacky film
  • Differential (barrier substrate film with FastelFilm one side and high strength pressure sensitive other side)
Release Liner Types
  • White paper release liner
  • Clear PET (polyester) release liner (multiple thicknesses and adhesive film release characteristics available depending on installation requirement)
  • Release liner printing available (2 color)
Delivery Formats
  • Master rolls
  • Custom and Narrow slit rolls
  • Die cut individuals
  • Multiple die cuts per sheet
  • Die cut continuous reels
  • Laser cut (precision tolerance)
Coating & Adhesive Color
  • Free standing film (standard)
  • 100% substrate surface coating
  • Discrete adhesive placement on substrate
  • Color: Clear | Hazy
  • Custom coloring available
Available Substrates
  • Aluminum foil
  • Copper foil
  • Stainless steel foil
  • Polyimide film
  • Polypropylene film
  • Customer defined substrate

DOE Testing (design of experiment)

When designing a new product, experimenting to determine the suitability of our products within the scope of your applications is key. Fastelfilm can be heated using commercially available or custom heating devices such as heat presses, ovens or heated rollers. Prior to testing FastelFilm, we encourage our customers to perform a DOE (design of experiment) based upon the FastelFilm melt point and substrates being bonded as well as other subsequent application sensitivities that may exist. Since all of our customer applications involve various substrate types, substrate thicknesses and heating devices, we strongly encourage our cusotmers to understand the relationship between your heating device's set temperature and what temperature is yielded at the bond line (area where the FastelFilm resides). Understanding the relationship between set temperature and bondline temperature will significantly help narrow the scope of DOE combinations and shorten your process towards optimization.

Preparation | Installation Guidelines

The following are general guidelines to be used as a preliminary basis to determine suitibility of FastelFilm. The below stated values are to be used as a starting point only and should be further tested to determine optimal heating time, temperature and pressure in order to yield the desired result. Since FastelFilm has no pre-determined heating time beyond heating to or past its melt point, it is important to understand the relationship between heating time, heating temperature and pressure applied during heating in order to optimize installation.
HPA-2500 Softening Point | Max Heating
Softenting Point: 80C Melt point: 120C (full liquid state) In order to acheive continuous temperature stability in field use, softening point should be higher than your device's established maximum operating temperature or higher than any post bonding internal temperature stability testing that may be required. Maximum Heating Temperature FastelFilm HPA-2500 can be heated alongside other materials that require higher heating. Maximum process heating temperature of the FasteFilm HPA-2500 is 176C. Prolonged heating exposure above this temperature may result in adhesive damage.
Surface Preparation
All surfaces should be clean and free debris. Surface can be cleaned with Isopropyl Alcohol (IPA) or solvent. All surfaces should be dry prior to installing adhesive. Additonal surface treatments may be considered depending on substrate material type and application requirements.
CORONA TREATED SURFACES Corona treated surface modification may be a benefit depending on substrate material type. Customer testing required.TEXTURED SURFACES Textured surface may be a benefit in order to create more surface area depending on substrate type. Customer testing required.ADHESION PROMOTERS It is important for customers to determine compatability of adhesive promoter treatment.
Tack Temperature
Type HPA-2500: 85C to 100C Liner note: adhesive pad should be handled with carrier liner. Heat through carrier liner to transfer heat. Once cooled, remove liner. Maintain adequate surface contact pressure during this process. Type: HPA-2500-PT (TACKY FILM) Heat not required. Press adhesive and liner backing firm against surface. Peel away liner. Dwell time for adhesive film transfer may vary depending on substrate type or environmental temperature. Testing required.
Full Bond Heating Temp
120C to 150C+ Heating temperature stated is at bond line (area where adhesive film resides). Necessary to acheive adequte wet-out of the adhesive onto the substrates. Adhesive should not be exposed to temperatures above 350F / 176C
Heating Pressure
3 PSI to 100 PSI+ Important to maintain good surface contact of the adhesive to the substrates. No set pressure required. Dependent on substrate type, thickness, interface area as well as substrate durability.
Heating Time
3 seconds to 30 seconds (variable)
No set heating time required. Dependent on thermal conductivity of substrates and heating devices. Minimum melt point must be acheived. No complex ramp up and ramp down patterns required unless other materials require this during the heating process.
Cooling (set) Time
Variable
Adhesive should be allowed to adequately cool below its melt point before applying stress. It is recommended (not required) to maintain pressure during cooling to promote surface contact during this process. Forced direct air systems okay to accelerate cooling.
Re-Work or Clean Up
120C to 150C+ While adhesive remains in its melted open state, disassemble substrates. For re-bonding, it is recommended to clean interface area and apply new adhesive pad. Traditional solvents (biosolvent or mineral spirits) or Isopropyl Alcohol (IPA) can be used to clean adhesive. Slight heat can also be applied to surface adhesive residue and wiped clean while adhesive is in softened state.
Viscosity Note
Fastelfilm is designed with a specific melt point temperature. Flow control within its melted state is a function of heating temperature and pressure. As the adhesive is heated further past its melt point temperature, its viscosity continuously decreases. Significant pressure within a low viscosity state can cause adhesive run-out outside the interface.
Interface Contact
Depending on your heating application setup, an interface pad between the heat source and stack-up may be considered to provide conformability across large interfaces. Soft, mid and hard durometer thermally conductive gap pads can be considered in order to minimize the temperature drop from heat source to bond line (area where Fastelfilm resides).
Heating Equipment
Heating can be acheived through the use of off the shelf standard heating equipment such as heat presses, ovens or heated rollers.
Click here to learn more about our recommended heating equipment partners.

Application Assistance

For further assistance and recommendations for installing and heating FastelFilm, please contact us Toll Free at 1-888-989-3832 (US Only) +1-949-369-7676 (International) or e-mail us at info@stretech.com
Request Sample or Technical Data Sheet
request samples  or technical data sheet