FASTELFILM HPB-1100 THERMAL BONDING AND SEALING FILM

FastelFilm HPB-1100 Heat Activated Adhesive Film

FastelFilm HPB-1100 offers a high temperature melt point of 230F/110C with an upper continuous operating temperature of 80C. FastelFilm HPB-1100 is an EVA / Synthetic Rubber blend adhesive film available within a range of film thicknesses and delivery formats from Fastel Adhesives.
FastelFilm HPB-1100 can be considered for applications where substrate or component heating sensitivities still exist but a higher continuous operating temperature of 80C is required for in-field use stability. With its higher 80C operating temperature, HPB-1100 can be considered for more rigorous applications within the electroncis, automotive of industrial assembly market segments. FastelFilm HPB-1100 performs well on a wide variety of metal and plastic substrates as well as low energy film surfaces. With flow characteristics that can be controlled with heating, FastelFilm HPB-1100 offers a quick and clean installation. FastelFilm HPB-1100 is available in a wide range of delivery formats including master rolls, slit rolls, die cuts or coated onto various substrate types.
Once the adhesive pad is heated past its melt point temperature and then cooled, the adhesive is set. Re-work can be acheived by re-heating to disassemble.
FastelFilm HPB-1100 Features and Benefits
  • Melt point temperature: 110C (mid-high melt design)
  • Maximum continuous operating temperature: 80C
  • EVA / synthetic rubber thermoplastic adhesive
  • Non-thermoset adhesive system (reworkable)
  • Inert thermoplastic formulation | solvent free
  • Excellent for bonding low energy surface plastics and films
  • HPB-1100 (dry at room temperature film surface)
  • HPB-1100-PT (tacky at room temperature film surface)
  • Ideal for bonding ultra heat sensitive substrates or reagents
  • Free standing film available in a range of thicknesses
  • 100% substrate surface coating available (films and foils)
  • Discrete substrate placement capability
  • Drop-in-place dry pad installation | clean adhesive assembly
  • Optional release liner backings (PET film or paper)
  • Optional liner release values (EZ to high release values)
  • Available in rolls, sheets or die cuts
To request samples or download the technical data sheet, please click on the respective link located to the right or call: TF: 1-888-989-3832 (US) International: +1-949-369-7676.
data sheetrequest samples

General Specifications

  • Melt point: 230F | 110C (full liquid state)
  • Continuous operating temperature: -30C to 80C (post bonding)
  • Chemistry: EVA/synthetic rubber thermoplastic (non-thermoset)
  • RoHS | REACH | Halogen Free Compliant
Format: Free standing dry film or tacky film at room temperature thermoplastic adhesive film with release liner.

Standard Cross Section

Standard Film Thickness
  • 0.08mm - 0.003"
  • 0.13mm - 0.005"
  • 0.25mm - 0.010"
  • 0.38mm - 0.015"
  • 0.51mm - 0.020"
  • 0.76mm - 0.030"
  • Custom film thickness available
Surface Types
  • HPB-1100: Dry film
  • HPB-1100-PT: Tacky Film
  • Differential (barrier substrate film with FastelFilm one side and high strength pressure sensitive adhesive other side)
Release Liner Types
  • White paper release liner
  • Clear PET (polyester) release liner (multiple thicknesses and adhesive film release characteristics available depending on installation requirement)
  • Release liner printing available (2 color)
Delivery Formats
  • Master rolls
  • Custom and Narrow slit rolls
  • Die cut individuals
  • Multiple die cuts per sheet
  • Die cut continuous reels
  • Laser cut (precision tolerance)
Coating & Adhesive Color
  • Free standing film (standard)
  • 100% substrate surface coating
  • Discrete adhesive placement on substrate
  • Translucent yellow (up to 0.13mm)
  • Opaque yellow (0.18mm and up)
  • Custom coloring available
Available Substrates
  • Aluminum foil
  • Copper foil
  • Stainless steel foil
  • Polyimide film
  • Polyester (PET) film
  • Polypropylene film
  • Customer defined substrate

DOE Testing (design of experiment)

When designing a new product, experimenting to determine the suitability of our products within the scope of your applications is key. Fastelfilm can be heated using commercially available or custom heating devices such as heat presses, ovens or heated rollers. Prior to testing FastelFilm, we encourage our customers to perform a DOE (design of experiment) based upon the FastelFilm melt point and substrates being bonded as well as other subsequent application sensitivities that may exist. Since all of our customer applications involve various substrate types, substrate thicknesses and heating devices, we strongly encourage our cusotmers to understand the relationship between your heating device's set temperature and what temperature is yielded at the bond line (area where the FastelFilm resides). Understanding the relationship between set temperature and bondline temperature will significantly help narrow the scope of DOE combinations and shorten your process towards optimization.

Preparation | Installation Guidelines

The following are general guidelines to be used as a preliminary basis to determine suitibility of FastelFilm. The below stated values are to be used as a starting point only and should be further tested to determine optimal heating time, temperature and pressure in order to yield the desired result. Since FastelFilm has no pre-determined heating time beyond heating to or past its melt point, it is important to understand the relationship between heating time, heating temperature and pressure applied during heating in order to optimize installation.
HPB-1100 Softening Pont | Max Heating
Softening Point: 80C Melt Point: 110C (full liquid state) In order to acheive continuous temperature stability in field use, softening point should be higher than your device's established maximum operating temperature or higher than any post bonding internal temperature stability testing that may be required. Maximum Processing Heating Temperature FasteFilm HPB-1100 can be heated alongside other materials that require higher heating. Maximum process heating temperature of the FastelFilm HPB-1100 is 162C. Prolonged heating exposure above this temperature may result in adhesive damage.
Surface Preparation
All surfaces should be clean and free debris. Surface can be cleaned with Isopropyl Alcohol (IPA) or solvent. All surfaces should be dry prior to installing adhesive. Additonal surface treatments may be considered depending on substrate material type and application requirements. CORONA TREATED SURFACES Corona treated surface modification may be a benefit depending on substrate material type. Customer testing required.TEXTURED SURFACES Textured surface may be a benefit in order to create more surface area depending on substrate type. Customer testing required.ADHESION PROMOTERS It is important for customers to determine compatability of adhesive promoter treatment.
Tack Temperature
Type HPB-1100: 85C to 100C Liner note: adhesive pad should be handled with carrier liner. Heat through carrier liner to transfer heat. Once cooled, remove liner. Maintain adequate surface contact pressure during this process. HPB-1100-PT (TACKY FILM) - heat not required. Press firm against surface. Peel away liner. Dwell time may vary depending on substrate type or environmental temperature. Testing required.
Full Bond Heating Temp
110C to 135C+ Heating temperature stated is at bond line (area where adhesive film resides). Necessary to acheive adequte wet-out of the adhesive onto the substrates. Adhesive should not be exposed to temperatures above 325F / 162C. HPB-1100-PT Note: for tacky film version, tack does not diminish after heating. Tackiness remains post heating.
Heating Pressure
3 PSI to 100 PSI+ Important to maintain good surface contact of the adhesive to the substrates. No set pressure required. Dependent on substrate type, thickness, interface area as well as substrate durability.
Heating Time
3 seconds to 30 seconds (variable)
No set heating time required. Dependent on thermal conductivity of substrates and heating devices. Minimum melt point must be acheived. No complex ramp up and ramp down patterns required unless other materials require this during the heating process.
Cooling (set) Time
Variable
Adhesive should be allowed to adequately cool below its melt point before applying stress. It is recommended (not required) to maintain pressure during cooling to promote surface contact during this process. Forced direct air systems okay to accelerate cooling.
Re-Work or Clean Up
110C to 135C+ While adhesive remains in its melted open state, disassemble substrates. For re-bonding, it is recommended to clean interface area and apply new adhesive pad. Traditional solvents (biosolvent or mineral spirits) or Isopropyl Alcohol (IPA) can be used to clean adhesive. Slight heat can also be applied to surface adhesive residue and wiped clean while adhesive is in softened state.
Viscosity Note
Fastelfilm is designed with a specific melt point temperature. Flow control within its melted state is a function of heating temperature and pressure. As the adhesive is heated further past its melt point temperature, its viscosity continuously decreases. Significant pressure within a low viscosity state can cause adhesive run-out outside the interface.
Interface Contact
Depending on your heating application setup, an interface pad between the heat source and stack-up may be considered to provide conformability across large interfaces. Soft, mid and hard durometer thermally conductive gap pads can be considered in order to minimize the temperature drop from heat source to bond line (area where Fastelfilm resides).
Heating Equipment
Heating can be acheived through the use of off the shelf heating equipment such as heat presses, ultrasonic welding presses, ovens or heated rollers.
Click here to learn more about our recommended heating equipment partner.
Heat Press and Ultrasonic Welding Equipment

Application Assistance

For further assistance and recommendations for installing and heating FastelFilm, please contact us Toll Free at 1-888-989-3832 (US Only) +1-949-369-7676 (International) or e-mail us at info@stretech.com
Request Sample or Technical Data Sheet
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