INTRAGRAPH HS HEAT SPREADING GRAPHITE FILM
IntraGraph HS | Thermally Conductive Heat Spreading Film
IntraGraph HS consists of more than 98% pure graphite designed with a flake like structure that exhibits anisotropic thermal conductivity in-plane (XY) and thru-plane (Z). IntraGraph HS offers a soft compliance allowing for excellent surface contact over larger than normal interface gaps.
IntraGraph HS Film's low density compared to copper or aluminum make it ideal for applications where either a low weight TIM material is required or a very high temperature resistance is needed while at the same time offering high in-plane thermal conductivity. In comparison to typical graphite films available in the market place, IntraGraph HS offers easy handling without worry of breaks or shatters in the film during installation.
IntraGraph HS is available in rolls, sheets or die cut to a specific customer outline.
IntraGraph HS Features and Benefits
- In-Plane (XY) thermal conductivity: 140 W/m-K
- Thru-plane (Z) thermal conductivity: 8.0 W/m-K
- Low cost graphite TIM material solution
- Thick foil allows for filling large gaps or uneven surfaces
- Compressed Graphite Material
- Non-Dielectric Thermal Pad
- Lightweight TIM pad solution
- Enhanced durability - resistant to handling
- Electrically conductive film properties
- High temperature resistant up to 300C
- 100% surface backed, discrete or edge adhesive tack options
- Insulating or conductive film lamination backing options
- Offers a 100% non-metallic TIM pad solution
- Excellent replacement for copper foil or alumium foil
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Film Substrate Thickness
- GF.13 - 0.13mm | 0.005"
- GF.25 - 0.25mm | 0.010"
Format: IntraGraph HS film only - dry surface
Standard Cross Section
Typical Applications
General Specifications
- Battery Thermal Management
- High Power Density Energy Storage
- Automotive Inverter | Modules
- Consumer Electronics (mobile)
- LED | Lighting (commercial and consumer device)
- High End Electronics and Computing
- Displays
- Medical Electronics Assembly
- Robotics
- Microprocessor | Heat Sink
- Memory Module | Heat Sink
- Single or Multi-Device Pad Configurations
- EMI-Shielding
- Laser Diodes
- In-Plane (XY) Thermal Conductivity: 140 W/m-K
- Thru-Plane (Z) Thermal Conductivity: 8.0 W/m-K
- Hardness: 85 (shore A)
- Volume Resistivity: 11.0 x 10^--4 ohm-cm
- Dielectric Constant: < 0.001 (@ 1MHz)
- Min/Max Operating Temperature: -240C to 300C
- Material Color: Dark Gray
- Material Surface: Dry
- Tack Options: Yes (PSA options listed at bottom)
- Barrier Laminate Options: Dielectric films and foils (contact us)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Thermal Impedance
Thermal impedance testing performed per ASTM D5470 Test Method. For applications that require lower contact resistance at the interface increasing heat flow, read more about IntraGraph PCM 50
GF.13 - 0.13mm | 0.005"
10 PSI - 0.120 oC-in^2/W
30 PSI - 0.090 oC-in^2/W
150 PSI - 0.060 oC-in^2/W
GF.25 - 0.25mm | 0.010"
10 PSI - 0.240 oC-in^2/W30 PSI - 0.160 oC-in^2/W150 PSI - 0.100 oC-in^2/W
Film Type | Film Thickness | Lamination Film Options
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us for additional pressure range figures.
Substrate
IntraGraph HS is a dry film (no coating) thermally conductivce graphte film.
To learn more about utilizing phase change coatings to significantly lower interface contact resistance, read more about IntraGraph PCM 50.
Film Lamination Options
PET Film
Kapton MT Film
Kapton MT+ Film
Aluminum Foil
Copper Foil
Stainless Steel Foil
SILTEL Films
SITLEL Gap Pad
Contact us for available types and film/foil thicknesses
Other Information
Material Formats
Master Rolls
Sheets
Die cut individual pads
Multiple die cut pads per master liner
Die cut continuous reels
Available Tack Backings
Optional acrylic pressure sensitive adhesive single side.
Optional edge strip pressure sensitive adhesive (outside of primary thermal via)
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet
Kapton is a registered trademark of Dupont Corporation