SILTEL NSG-TC2.5 SILICONE FREE THERMAL GAP PAD

SILTEL NSG-TC2.5 Silicone Free Thermallly Conductive Gap Pad

SILTEL NSG-TC2.5 is a silicone free electrically insulating thermally conductive gap pad ideal applications where volatile siloxanes is a concern and the need to provide an efficient heat transfer of a gap is required. NSG-TC2.5 is optimal for electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. NSG-TC2.5 offers good thermal conductivity packaged with high surface compliance all within an extremely conformable acrylate pad design. Double side natural light tack configuration is standard. NSG-TC2.5 is available with an optional single side tack lamination which adds a more aggressive tack to one side (version NSG-TC2.5-F1). At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer. SILTEL NSG-TC2.5 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL NSG-TC2.5 Silicone Free Features and Benefits
  • Thermal Conductivity - 2.5 W/m-K
  • Hardness: 47 (shore 00)
  • Silicone free | siloxane free acrylate pad design
  • Soft and compliable thermal pad
  • Electrically insulating solution
  • Excellent gap filling properties
  • Ideal for managing a range of flatness conditions
  • Operates at low pressure
  • Double side natural tack pad (standard)
  • Optional tack laminate second side (NSG-TC2.5-F1)
  • Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • NSG1.0-TC2.5 (1.00mm)
  • NSG2.0-TC2.5 (2.00mm)
  • NSG3.0-TC2.5 (3.00mm)
  • NSG4.0-TC2.5 (4.00mm)
Format: Unsupported ceramic filled elastomer (standard)

Standard Cross Section

Typical Applications

General Specifications

  • SMD Packages
  • Through Hole Vias
  • Capacitors
  • Heat Pipes
  • Multi-Chip Configurations
  • Interface Gap Management
  • Automotive Electronics
  • Consumer Electronics
  • Medical Electronics
  • Heat Sink | Case Sink
  • Coating: Ceramic filled acrylate
  • Support: None
  • Operating Temperautre: -40C to 125C
  • Material Color: Brown
  • Gap Pad Surface: Double sided natrual light tack
  • Tack Back Options: F1 (added single side tack option)

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
NSG1.0-TC2.5 (1.00mm)
Thermal Impedance 10 PSI - 0.800 oC-in^2/W 30 PSI - 0.670 oC-in^2/W 60 PSI - 0.600 oC-in^2/W Dielectric Strength 2.1 kV/mm Volume Resisitivity 1.0 x 10^11 Dielectric Constant 18.2 @ 1MHz
NSG2.0-TC2.5 (2.00mm)
Thermal Impedance10 PSI - 1.280 oC-in^2/W30 PSI - 1.050 oC-in^2/W60 PSI - 0.920 oC-in^2/W
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz
NSG3.0-TC2.5 (3.00mm)
Thermal Impedance10 PSI - 1.790 oC-in^2/W30 PSI - 1.510 oC-in^2/W60 PSI - 1.190 oC-in^2/W
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz
NSG4.0-TC2.5 (4.00mm)
Thermal Impedance10 PSI - 2.200 oC-in^2/W30 PSI - 1.810 oC-in^2/W60 PSI - 1.410 oC-in^2/W
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
F1 - single side tack option by film lamination. Adds more aggressive tack 1 side. Note: standard pad configuration is light tack on both sides
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
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