SILTEL NSG-TC2.5 Silicone Free Thermallly Conductive Gap Pad
- Thermal Conductivity - 2.5 W/m-K
- Hardness: 47 (shore 00)
- Silicone free | siloxane free acrylate pad design
- Soft and compliable thermal pad
- Electrically insulating solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- Double side natural tack pad (standard)
- Optional tack laminate second side (NSG-TC2.5-F1)
- Availabe in sheets or die cuts
Material Thickness
- NSG1.0-TC2.5 (1.00mm)
- NSG2.0-TC2.5 (2.00mm)
- NSG3.0-TC2.5 (3.00mm)
- NSG4.0-TC2.5 (4.00mm)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled acrylate
- Support: None
- Operating Temperautre: -40C to 125C
- Material Color: Brown
- Gap Pad Surface: Double sided natrual light tack
- Tack Back Options: F1 (added single side tack option)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
NSG1.0-TC2.5 (1.00mm)
NSG2.0-TC2.5 (2.00mm)
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz
NSG3.0-TC2.5 (3.00mm)
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz
NSG4.0-TC2.5 (4.00mm)
Dielectric Strength2.1 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Constant19.6 @ 1MHz