SILTEL NSG-TC3.0 SILICONE FREE THERMAL GAP PAD
SILTEL NSG-TC3.0 Silicone Free Thermallly Conductive Gap Pad
SILTEL NSG-TC3.0 is a silicone free electrically insulating thermally conductive gap pad ideal applications where volatile siloxanes is a concern and the need to provide an efficient heat transfer of a gap is required. NSG-TC3.0 is optimal for electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. NSG-TC3.0 offers good thermal conductivity packaged with high surface compliance all within an extremely conformable acrylate pad design. Double side natural light tack configuration is standard.
At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer.
SILTEL NSG-TC3.0 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL NSG-TC3.0 Silicone Free Features and Benefits
- Thermal Conductivity - 3.0 W/m-K
- Hardness: 75 (shore 00)
- Silicone free | siloxane free acrylate pad design
- Soft and compliable thermal pad
- Electrically insulating solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- Double side natural tack pad (standard)
- Availabe in sheets or die cuts
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Material Thickness
- NSG.50-TC3.0 (0.50mm)
- NSG1.0-TC3.0 (1.00mm)
- NSG2.0-TC3.0 (2.00mm)
- NSG3.0-TC3.0 (3.00mm)
- NSG5.0-TC3.0 (5.00mm)
Format: Unsupported ceramic filled elastomer (standard)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled acrylate
- Support: None
- Operating Temperature: -40C to 130C
- Material Color: Light Gray
- Gap Pad Surface: Double sided natrual light tack
- Tack Back Options: None
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
NSG.50-TC3.0 (0.50mm)
Thermal Impedance
10 PSI - 0.450 oC-in^2/W
30 PSI - 0.420 oC-in^2/W
60 PSI - 0.380 oC-in^2/W
Dielectric Strength
7.8 kV/mm
Volume Resisitivity
1.0 x 10^13
NSG1.0-TC1.0 (1.00mm)
Thermal Impedance10 PSI - 0.650 oC-in^2/W30 PSI - 0.640 oC-in^2/W60 PSI - 0.630 oC-in^2/W
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
NSG2.0-TC3.0 (2.00mm)
Thermal Impedance10 PSI - 1.250 oC-in^2/W30 PSI - 1.120 oC-in^2/W60 PSI - 1.030 oC-in^2/W
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
NSG3.0-TC3.0 (3.00mm)
Thermal Impedance10 PSI - 1.720 oC-in^2/W30 PSI - 1.570 oC-in^2/W60 PSI - 1.470 oC-in^2/W
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
NSG5.0-TC3.0 (5.00mm)
Thermal Impedance10 PSI - 2.600 oC-in^2/W30 PSI - 2.180 oC-in^2/W60 PSI - 1.870 oC-in^2/W
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
Dielectric Strength7.8 kV/mm
Volume Resisitivity1.0 x 10^11
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
No additional tack options available
Note: standard pad configuration is light tack on both sides
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet