SILTEL SP is an electrically insulating thermally conductive film consisting of a high voltage resistant polyimide film support coated on both sides with a thermally conductive silicone coating optimizing heat transfer between electronic packages and heat sinks. Excellent thermal performance is reached through the design of the specifically formulated ceramic filled silicone coating. When subjected under pressure, low thermal impedance is reached packaged with reliable dielectric strength.
The polyimide substrate allows SILTEL SP to maintain its mechanical stability and good cut thru resistance. With the ability to apply optional pressure sensitive adhesive to one or both sides of the SILTEL film for assembly allows SILTEL SP to be a cost-effective thermal interface material solution for a wide range of electronic assembly applications.
SILTEL SP is available in log rolls, slit rolls of TIMTEL die cuts to match a variety of industry standard outlines or customer defined outlines.