SILTEL SP THERMALLY CONDUCTIVE SILICONE FILM
SILTEL SP Thermally Conductive Silicone Film
SILTEL SP is an electrically insulating thermally conductive film consisting of a high voltage resistant polyimide film support coated on both sides with a thermally conductive silicone coating optimizing heat transfer between electronic packages and heat sinks. Excellent thermal performance is reached through the design of the specifically formulated ceramic filled silicone coating. When subjected under pressure, low thermal impedance is reached packaged with reliable dielectric strength.
The polyimide substrate allows SILTEL SP to maintain its mechanical stability and good cut thru resistance. With the ability to apply optional pressure sensitive adhesive to one or both sides of the SILTEL film for assembly allows SILTEL SP to be a cost-effective thermal interface material solution for a wide range of electronic assembly applications.
SILTEL SP is available in log rolls, slit rolls of TIMTEL die cuts to match a variety of industry standard outlines or customer defined outlines.
SILTEL SP Features and Benefits
- Polyimide film substrate support
- High and reliable dielectric strength
- Excellent thermal contact
- High mechanical stability
- Offers high temperature stability
- Soft and conforming ceramic filled silicone coating
- Ideal for a range of surface flatness conditions
- Optional 100% surface tack back (repositionable)
- Optional discrete tack placement (repositionable)
- Ideal for many types of transistor and device outlines.
- Available in rolls, sheets or die cuts
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Material Thickness
- SP.11 - 0.110mm | 0.0043"
- SP.15 - 0.150mm | 0.0059"
Format: Polyimide film substrate coated both sides with a uniform thickness of ceramic filled silicone compound.
Standard Cross Section
Typical Applications
General Specifications
- Transitor Devices (TO-218, TO-220, TO-247, TO-264)
- Motor - Power Control Units
- Diodes / Relays
- Power Supply | UPS Systems
- Power Semiconductor
- RF Components
- LED Assembly
- Heat Sink | Case Sink
- Chassis Assembly
- Single or Multi-Device Pad Configurations
- Coating: Ceramic filled silicone
- Support: Polyimide film
- Operating Temperature: -65C to 180C
- Material Color: Light Brown
- Material Surface: Dry Coating
- Tack Back Options: SIL1 (see below)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SP.11 0.110mm | 0.0043"
Thermal Impedance
30 PSI - 0.550 oC-in^2/W
150 PSI - 0.290 oC-in^2/W
Breakdown Voltage
6.00 kV AC
SP.15 0.150mm | 0.0059"
Thermal Impedance
30 PSI - 0.750 oC-in^2/W150 PSI - 0.400 oC-in^2/W
Breakdown Voltage
> 6.00 kV AC
Other Information
Material Formats
Master Rolls
Custom Slit Rolls
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Die cut continuous reels
Available Tack Backings
SIL1 (0.025mm | 0.001"), low tack repositionable, high temperature silicone tack
100% surface backed or discrete tack placement available.
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.