SILTEL SF-TC1.2 Thermally Conductive Silicone Film
- Thermal Conductivity - 1.2 W/m-K
- Fiberglass supported - excellent mechanical stability
- High dielectric strength
- Excellent thermal contact
- Excellent chemical resistance
- Offers high temperature stability
- Soft and conforming ceramic filled silicone coating
- Ideal for a range of surface flatness conditions
- Optional 100% surface tack back (repositionable)
- Optional discrete tack placement (repositionable)
- Ideal for many types of transistor and device outlines.
- Available in rolls, sheets or die cuts
Material Thickness
- SF.23-TC1.2 (0.23mm)
- SF.30-TC1.2 (0.30mm)
- SF.45-TC1.2 (0.45mm)
Standard Cross Section
Typical Applications
General Specifications
- Transitor Devices (TO-218, TO-220, TO-247, TO-264)
- Motor - Power Control Units
- Diodes / Relays
- Power Supply | UPS Systems
- Power Semiconductor
- RF Components
- LED Assembly
- Heat Sink | Case Sink
- Chassis Assembly
- Single or Multi-Device Pad Configurations
- Coating: Ceramic filled silicone
- Support: Fiberglass matrix
- Operating Temperautre: -50C to 180C
- Material Color: Gray
- Material Surface: Dry Coating
- Tack Back Options: SIL1 or A1 (see below)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SF.23-TC1.2 (0.23mm)
SF.30-TC1.2 (0.30mm)
Tensile Strength4.1 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm
SF.45-TC1.2 (0.45mm)
Tensile Strength2.9 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm