SILTEL SF-TC1.2 THERMALLY CONDUCTIVE SILICONE FILM
SILTEL SF-TC1.2 Thermally Conductive Silicone Film
SILTEL SF-TC1.2 is an electrically insulating thermally conductive silicone film (fiberglass reinforced) for use between heat generating electronic devices and heat sink or case sink structures. SF-TC1.2 offers cost effective performance with it’s reliable thermal conductivity of 1.2 W/m-K. But still offers a reduction in thermal resistance during compression, high dielectric properties and the same excellent handling characteristics found in other higher thermal performing SILTEL Film products.
The fiberglass reinforcement allows the SF-TC1.2 to maintain its mechanical stability and good cut through resistance. With the ability to apply optional pressure sensitive adhesive to one or both sides of the silicone film for assembly allows the SF-TC1.2 film to be a cost-effective thermal interface material for a wide range of electronic assembly applications.
SILTEL SF-TC1.2 is available as log rolls, slit rolls or TIMTEL die cuts to match a wide range of industry standard or customer defined outlines.
SILTEL SF-TC1.2 Features and Benefits
- Thermal Conductivity - 1.2 W/m-K
- Fiberglass supported - excellent mechanical stability
- High dielectric strength
- Excellent thermal contact
- Excellent chemical resistance
- Offers high temperature stability
- Soft and conforming ceramic filled silicone coating
- Ideal for a range of surface flatness conditions
- Optional 100% surface tack back (repositionable)
- Optional discrete tack placement (repositionable)
- Ideal for many types of transistor and device outlines.
- Available in rolls, sheets or die cuts
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Material Thickness
- SF.23-TC1.2 - 0.23mm | 0.009"
- SF.30-TC1.2 - 0.30mm | 0.012"
- SF.45-TC1.2 - 0.45mm | 0.018"
Format: Fiberglass reinforced ceramic filled silicone thermal pad
Standard Cross Section
Typical Applications
General Specifications
- Transitor Devices (TO-218, TO-220, TO-247, TO-264)
- Motor - Power Control Units
- Diodes / Relays
- Power Supply | UPS Systems
- Power Semiconductor
- RF Components
- LED Assembly
- Heat Sink | Case Sink
- Chassis Assembly
- Single or Multi-Device Pad Configurations
- Coating: Ceramic filled silicone
- Support: Fiberglass matrix
- Operating Temperature: -50C to 180C
- Material Color: Gray
- Material Surface: Dry Coating
- Tack Back Options: SIL1 (see below)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SF.23-TC1.2 0.23mm | 0.009"
Thermal Impedance
30 PSI - 0.790 oC-in^2/W
150 PSI - 0.550 oC-in^2/W
Tensile Strength
5.0 kpsi
Breakdown Voltage
5.50 kV AC
Volume Resitivity
> 1.0 x 10^11 ohm-cm
SF.30-TC1.2 0.30mm | 0.012"
Thermal Impedance30 PSI - 1.050 oC-in^2/W150 PSI - 0.750 oC-in^2/W
Tensile Strength4.1 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm
Tensile Strength4.1 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm
SF.45-TC1.2 0.45mm | 0.018"
Thermal Impedance30 PSI - 1.550 oC-in^2/W150 PSI - 1.250 oC-in^2/W
Tensile Strength2.9 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm
Tensile Strength2.9 kpsi
Breakdown Voltage>6.00 kV AC
Volume Resitivity> 1.0 x 10^11 ohm-cm
Other Information
Material Formats
Master Rolls
Custom Slit Rolls
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Die cut continuous reels
Available Tack Backings
SIL1 Tack (0.025mm, 0.001") low tack repositionable, high temperature silicone tack
100% surface backed or discrete tack placement available.
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.