SILTEL SF-TC5.0 THERMALLY CONDUCTIVE SILICONE FILM

SILTEL SF-TC5.0 Thermally Conductive Silicone Film

SILTEL SF-TC5.0 is an electrically insulating thermally conductive silicone film (fiberglass reinforced) for use between heat generating electronic devices and heat sink or case sink structures. SF-TC5.0 offers high performance with a thermal conductivity of 5.0 W/m-K. SF-TC5.0 offers a reduction in thermal resistance during compression, high dielectric properties and excellent handling characteristics. The fiberglass reinforcement allows the SF-TC5.0 to maintain its mechanical stability and good cut through resistance. With the ability to apply optional pressure sensitive adhesive to one or both sides of the silicone film for assembly allows the SF-TC5.0 film to be a cost-effective thermal interface material for a wide range of electronic assembly applications. SILTEL SF-TC5.0 is available in sheets or TIMTEL die cuts to match a wide range of industry standard or customer defined outlines.
SILTEL SF-TC5.0 Features and Benefits
  • Thermal Conductivity - 5.0 W/m-K
  • Fiberglass supported - excellent mechanical stability
  • High dielectric strength
  • Excellent thermal contact
  • Excellent chemical resistance
  • Offers high temperature stability
  • Soft and conforming ceramic filled silicone coating
  • Ideal for a range of surface flatness conditions
  • Optional 100% surface tack back (repositionable)
  • Opitonal discrete tack placement (repositionable)
  • Ideal for many types of transistor and device outlines.
  • Available in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • SF.20-TC5.0 (0.20mm)
  • SF.30-TC5.0 (0.30mm)
  • SF.45-TC5.0 (0.45mm)
  • SF.80-TC5.0 (0.80mm)
Format: Fiberglass reinforced ceramic filled silicone thermal pad

Standard Cross Section

Typical Applications

General Specifications

  • Transitor Devices (TO-218, TO-220, TO-247, TO-264)
  • Motor - Power Control Units
  • Diodes / Relays
  • Power Supply | UPS Systems
  • Power Semiconductor
  • RF Components
  • LED Assembly
  • Heat Sink | Case Sink
  • Chassis Assembly
  • Single or Multi-Device Pad Configurations
  • Coating: Ceramic filled silicone
  • Support: Fiberglass matrix
  • Operating Temperautre: -50C to 200C
  • Material Color: White
  • Material Surface: Dry Coating
  • Tack Back Options: A1

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SF.20-TC5.0 (0.20mm)
Thermal Impedance 30 PSI - 0.290 oC-in^2/W 150 PSI - 0.110 oC-in^2/W Tensile Strength 1.3 kpsi Breakdown Voltage 3.0 kV AC Volume Resitivity 1.7 x 10^15 ohm-cm Dielectric Constant 3.3 @ 1 MHz
SF.30-TC5.0 (0.30mm)
Thermal Impedance30 PSI - 0.320 oC-in^2/W150 PSI - 0.150 oC-in^2/W
Tensile Strength1.2 kpsi
Breakdown Voltage6.0 kV AC
Volume Resitivity7.9 x 10^15 ohm-cm Dielectric Constant 3.3 @ 1 MHz
SF.45-TC5.0 (0.45mm)
Thermal Impedance 30 PSI - 0.350 oC-in^2/W 150 PSI - 0.170 oC-in^2/W Tensile Strength 0.70 kpsi Breakdown Voltage 9.0 kV AC Volume Resitivity 9.2 x 10^15 ohm-cm Dielectric Constant 3.3 @ 1 MHz
SF.80-TC5.0 (0.80mm)
Thermal Impedance30 PSI - 0.520 oC-in^2/W150 PSI - 0.270 oC-in^2/W
Tensile Strength0.60 kpsi
Breakdown Voltage>10 kV AC
Volume Resitivity8.9 x 10^15 ohm-cm Dielectric Constant 3.3 @ 1 MHz

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
A1 Tack (nominal thickness) lower tack repositionable
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
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