SILTEL S-TC2.1 THERMALLY CONDUCTIVE SILICONE FILM

SILTEL S-TC2.1 Thermally Conductive Silicone Film

SILTEL S-TC2.1 is a soft and unsupported free standing ceramic filled thermally conductive film offering efficient heat transfer through high surface compliance. S-TC2.1 offers reliable performance with a thermal conductivity of 2.1 W/m-K. The soft ceramic filled silicone design offers excellent gap filling and gaurantees high surface compliance even at lower pressures. SILTEL S-TC2.1 is available in sheets or TIMTEL die cuts to match a wide range of industry standard or customer defined outlines.
SILTEL S-TC2.1 Features and Benefits
  • Thermal Conductivity - 2.1 W/m-K
  • Unsupported ceramic filled silicone film
  • High surface compliance
  • Excellent thermal contact
  • Excellent chemical resistance
  • Offers high temperature stability
  • Suitable for low and high pressure applications
  • Ideal for a range of surface flatness conditions
  • Available in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
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Material Thickness

  • S.20-TC2.1 (0.20mm)
  • S.30-TC2.1 (0.30mm)
  • S.45-TC2.1 (0.45mm)
Format: Free standing ceramic filled silicone film (unsupported)

Standard Cross Section

Typical Applications

General Specifications

  • Transitor Devices (TO-218, TO-220, TO-247, TO-264)
  • Motor - Power Control Units
  • Diodes / Relays
  • Power Supply | UPS Systems
  • Power Semiconductor
  • RF Components
  • LED Assembly
  • Heat Sink | Case Sink
  • Chassis Assembly
  • Single or Multi-Device Pad Configurations
  • Coating: Ceramic filled silicone
  • Support: none (free standing)
  • Operating Temperautre: -50C to 200C
  • Material Color: Light Green (0.23mm)
  • Material Surface: Dry Coating
  • Tack Back Options: SIL1

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
S.20-TC2.1 (0.20mm)
Thermal Impedance 30 PSI - 0.500 oC-in^2/W 150 PSI - 0.300 oC-in^2/W Tensile Strength 0.45 kpsi Breakdown Voltage 3.0 kV AC Volume Resitivity 1.5 x 10^13 ohm-cm Dielectric Constant 5.5 @ 1 MHz
S.30-TC2.1 (0.30mm)
Thermal Impedance30 PSI - 0.560 oC-in^2/W150 PSI - 0.350 oC-in^2/W
Tensile Strength0.45 kpsi
Breakdown Voltage5.0 kV AC
Volume Resitivity6.0 x 10^13 ohm-cm
Dielectric Constant5.5 @ 1 MHz
S.45-TC2.1 (0.45mm)
Thermal Impedance30 PSI - 0.590 oC-in^2/W150 PSI - 0.410 oC-in^2/W
Tensile Strength0.45 kpsi
Breakdown Voltage8.0 kV AC
Volume Resitivity5.4 x 10^13 ohm-cm
Dielectric Constant5.5 @ 1 MHz
S.80-TC2.1 (0.80mm)
Thermal Impedance30 PSI - 0.710 oC-in^2/W150 PSI - 0.550 oC-in^2/W
Tensile Strength0.45 kpsi
Breakdown Voltage9.0 kV AC
Volume Resitivity7.7 x 10^13 ohm-cm
Dielectric Constant5.5 @ 1 MHz

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
SIL1 Tack (0.025mm) lower tack repositionable high temperature silicone
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
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