SILTEL SL-TC20.0 THERMALLY CONDUCTIVE SILICONE FILM
SILTEL SL-TC20.0 Ultra-High Thermally Conductive Gap Pad
SILTEL SL-TC20.0 offers an ultra high thermal conductivity of 20.0 W/m-K packaged within a soft and compliant non-dielectric thermal film design. SL-TC20.0 is suitable for a range of electronic packages and heat sinks where large gaps and big flatness tolerances exist.
SL-TC20.0's highly filled thermally conductive form offers high anisotropic thermal conductivty packaged with a conformal surface structure and softness that is gauranteed to provide excellent compliance even at low pressures.
SL-TC20.0 is ideal for non-dielectric applications that require ultra-high thermal performance, gap filling and high surface compliance.
SILTEL SL-TC20.0 Features and Benefits
- Ultra High Thermal Conductivity - 20.0 W/m-K
- Anisotropic thermal film design
- Non-dielectric thermal pad solution
- Available with a secondary dielectric film barrier (optional)
- High surface compliance and extremely soft
- Shock absorbing
- Excellent thermal contact
- Excellent chemical resistance
- Offers high temperature stability
- Ideal for a range of surface flatness conditions
- Standard tack on both sides of film
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Material Thickness
- SL.25-TC20.0 (0.25mm)
- SL.50-TC20.0 (0.50mm)
Format: Free standing thermally conductive particle filled silicone film (unsupported)
Standard Cross Section
Typical Applications
General Specifications
- MOSFET and IGBT
- Motor - Power Control Units
- Automotivce Management Systems
- Power Supply | UPS Systems
- Power Semiconductor
- Solar Systems
- Power Diodes
- AC/DC Converters
- Switch Mode Power Supplies
- Large Gaps or High Surface Flatness Tolerances
- Coating: silicone
- Support: none (free standing)
- Operating Temperature: -50C to 180C
- Material Color: Dark Gray
- Material Surface: Dry Coating
- Tack Back Options: Tacky both sides
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SL.25-TC20.0 (0.25mm)
Thermal Impedance
10 PSI - 0.080 oC-in^2/W
30 PSI - 0.060 oC-in^2/W
90 PSI - 0.050 oC-in^2/W
Hardness
55 (shore 00)
Volume Resitivity
<100 ohm-cm
SL.50-TC20.0 (0.50mm)
Thermal Impedance10 PSI - 0.120 oC-in^2/W30 PSI - 0.100 oC-in^2/W90 PSI - 0.090 oC-in^2/W
Hardness55 (shore 00)
Volume Resitivity<100 ohm-cm
Hardness55 (shore 00)
Volume Resitivity<100 ohm-cm
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
None - standard film is tacky both sides.
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.