SILTEL SL-TC15.0 THERMALLY CONDUCTIVE SILICONE FILM
SILTEL SL-TC15.0 Ultra-High Thermally Conductive Gap Pad
SILTEL SL-TC15.0 offers an ultra high thermal conductivity of 15.0 W/m-K packaged within a soft and compliant low-dielectric thermal film design. SL-TC15.0 is suitable for a range of electronic packages and heat sinks where large gaps and big flatness tolerances exist.
SL-TC15.0's highly filled thermally conductive form offers high anisotropic thermal conductivty packaged with a conformal surface structure and extreme softness that is gauranteed to provide excellent compliance even at low pressures.
SL-TC15.0 is ideal for application not needing much dielectric protection but requires ultra-high thermal performance, gap filling and high surface compliance.
SILTEL SL-TC15.0 Features and Benefits
- Ultra High Thermal Conductivity - 15.0 W/m-K
- Anisotropic thermal film design
- Low dielectric thermal pad solution
- High surface compliance and extremely soft
- Available in a range of film thicknesses
- Shock absorbing
- Excellent thermal contact
- Excellent chemical resistance
- Offers high temperature stability
- Ideal for a range of surface flatness conditions
- Standard surface tack both sides
- Ideal for large gaps where high heat transfer is required
- Available in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Material Thickness
- SL.50-TC15.0 (0.50mm)
- SL1.0-TC15.0 (1.00mm)
- SL2.0-TC15.0 (2.00mm)
Format: Free standing thermally conductive particle filled silicone film (unsupported)
Standard Cross Section
Typical Applications
General Specifications
- MOSFET and IGBT
- Motor - Power Control Units
- Automotivce Management Systems
- Power Supply | UPS Systems
- Power Semiconductor
- Solar Systems
- Power Diodes
- AC/DC Converters
- Switch Mode Power Supplies
- Large Gaps or High Surface Flatness Tolerances
- Coating: silicone
- Support: none (free standing)
- Operating Temperature: -50C to 180C
- Material Color: Black
- Material Surface: Tacky both sides
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SL.50-TC15.0 (0.50mm)
Thermal Impedance
10 PSI - 0.180 oC-in^2/W
30 PSI - 0.160 oC-in^2/W
90 PSI - 0.150 oC-in^2/W
Hardness
35 (shore 00)
Volume Resitivity
>1.0 x 10^7 ohm-cm
Dielectric Strength
~0.30 kV/mm
SL1.0-TC15.0 (1.00mm)
Thermal Impedance10 PSI - 0.290 oC-in^2/W30 PSI - 0.280 oC-in^2/W90 PSI - 0.270 oC-in^2/W
Hardness35 (shore 00)
Volume Resitivity>1.0 x 10^7 ohm-cm
Dielectric Strength~0.30 kV/mm
Hardness35 (shore 00)
Volume Resitivity>1.0 x 10^7 ohm-cm
Dielectric Strength~0.30 kV/mm
SL2.0-TC15.0 (2.00mm)
Thermal Impedance10 PSI - 0.540 oC-in^2/W30 PSI - 0.500 oC-in^2/W90 PSI - 0.470 oC-in^2/W
Hardness35 (shore 00)
Volume Resitivity>1.0 x 10^7 ohm-cm
Dielectric Strength~0.30 kV/mm
Hardness35 (shore 00)
Volume Resitivity>1.0 x 10^7 ohm-cm
Dielectric Strength~0.30 kV/mm
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
None - standard film is tacky both sides.
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.