TIMtelligent Thermal Materials
Thermal Material Solutions
As our world demands smaller and more powerful electronic packages, TIMTEL continuously innovates to meet those thermal demands. We offer an extensive line of standard thermal management materials as well as custom thermal material formulations, constructions and die cut designs targeted towards specific thermal application and installation requirements.
We support multiple market segments across the electronics assembly market including power electronics, automotive, consumer electronics, lighting, medical and automation electronics.
To get started, please select from one of the product categories below.
Modules
IGBT Power Modules
TEC Modules
Motor Drives
Power Inverter
Dielectric Film Solutions
Non-Dielectric Film Solutions
Automotive Assembly
Energy Storage
High Power Density Storage
Battery Thermal Management
Thermal Spreading Solutions
LED | LIGHTING
Thermal Transfer Films
Heat Spreading Films
Thermal Tape - Laminations
CPU-Heat Sink
TIM2 Thermal Films
CPU - Heat Sink Mounting
Memory Module - Heat Sink
MOSFET Device
Heat Sink | Case Sink Assembly
Multi-Chip | Multi-Device
Dielectric | Non-Dielectric Pads
Timtel Thermal Management Products
Phase Change Materials
Free standing phase change films and phase change coated substrates designed to provide low interfacial surface resistance for efficient heat transfer.
Thermal Silicone Films
Thermally conductive ceramic filled silicone films with either polyimide film or fiberglass reinforcement support. Range of thicknesses and tack options.
Thermal Gap Pads
Gap filling thermal pads in a range of durometers, thermal performances as well as tack configurations. Available as sheets or pre-formed to your specific outline.
Thermal Adhesive Film
Thermally conductive adhesive films in a free standing film or substrate supported format. Substrates include non-dielectric and dielectric options in a range of thicknesses.
Heat Spreader Films
Heat spreading thermally conductive graphite films in a dry or phase change coated format for efficient XYZ heat transfer. Single side phase change coating and tack options available.
Phase Change Compound Bar
Phase change thermal compound bars designed for manual swiping of compound on your interface surface. Excellent for re-work scenarios. Available in a bar or pen sizes.
EMI Shielding
Utilizes a copper foil or graphite foil insert and exposed ground connection configuration on the exterior or interior of the pad. Suppresses radiated emissions generated in high frequency transistor applications