SILTEL SG-TC3.0X THERMALLY CONDUCTIVE ULTRA SOFT PAD
SILTEL SG-TC3.0X Ultra Soft Thermally Conductive Gap Pad
SILTEL SG-TC3.0X is an electrically insulating thermally conductive ULTRA Soft silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC3.0X demonstrates reliable thermal conductivity packaged with high surface compliance all within an extremely conformable elastomer design. Double side tack configuration is standard. SG-TC3.0X is available with an optional single side tack lamination which adds a more aggressive tack to one side (version SG-TC3.0X-A1).
At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer.
SILTEL SG-TC3.0X is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC3.0X Ultra Soft Features and Benefits
- Thermal Conductivity - 3.0 W/m-K
- Ultra Soft Design: 15 (shore 00)
- Extremely soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard single side light tack pad configuration
- Optional tack laminate second side (SG-TC3.0X-A1)
- Availabe in sheets or die cuts
To request samples or download the technical data sheet, please click on the respective link located to the right or call:
TF: 1-888-989-3832 (US)
International: +1-949-369-7676.
Material Thickness
- SG.50-TC3.0X (0.50mm)
- SG1.0-TC3.0X (1.00mm)
- SG2.0-TC3.0X (2.00mm)
- SG3.0-TC3.0X (3.00mm)
- Additional 4mm thickness available upon request
Format: Unsupported ceramic filled silicone (standard).
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: None
- Operating Temperature: -40C to 200C
- Material Color: Light Gray
- Gap Pad Surface: Double sided light tack
- Tack Back Options: A1 (added single side tack option)
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC3.0X (0.50mm)
Thermal Impedance
10 PSI - 0.490 oC-in^2/W
30 PSI - 0.430 oC-in^2/W
60 PSI - 0.360 oC-in^2/W
Dielectric Strength
> 10 kV/mm
Volume Resisitivity
1.0 x 10^10
SG1.0-TC3.0X (1.00mm)
Thermal Impedance10 PSI - 0.760 oC-in^2/W30 PSI - 0.620 oC-in^2/W60 PSI - 0.480 oC-in^2/W
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10
SG2.0-TC3.0X (2.00mm)
Thermal Impedance
10 PSI - 1.170 oC-in^2/W
30 PSI - 0.890 oC-in^2/W
60 PSI - 0.640 oC-in^2/W
Dielectric Strength
> 10 kV/mm
Volume Resisitivity
1.0 x 10^10
SG3.0-TC3.0X (3.00mm)
Thermal Impedance10 PSI - 1.570 oC-in^2/W30 PSI - 1.150 oC-in^2/W60 PSI - 0.820 oC-in^2/W
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10
Dielectric Strength> 10 kV/mm
Volume Resisitivity1.0 x 10^10
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
A1 - single side tack option by film lamination. Adds more aggressive tack 1 side.
Note: standard pad configuration is light tack on both sides
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet