SILTEL SG-TC11.0S Ultra Soft Thermally Conductive Gap Pad
- High Thermal Conductivity - 11.0 W/m-K
- Ultra Soft Design: Extreme softness (putty film type)
- Extremely soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent filling for minimal gaps
- Ideal for managing a range of flatness conditions
- Operates at almost zero pressure
- High chemical resistance
- Offers high temperature stability
- Standard double side tack configuration
- Availabe in sheets or die cuts
Material Thickness
- SG1.5-TC11.0S (1.50mm)
- SG2.0-TC11.0S (2.00mm)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone (putty film type)
- Support: none
- Operating Temperautre: -50C to 180C
- Material Color: Light Gray
- Gap Pad Surface: Light tack both sides
- Tack Back Options: none
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG1.5-TC11.S (1.50mm)
SG2.0-TC11.0S (2.00mm)
Dielectric Strength11 kV/mm
Volume Resistivity7 x 10^7
Dielectric Constant7.5 @ 1 MHZ