SILTEL SG-TC1.4-GF THERMALLY CONDUCTIVE ULTRA SOFT PAD

SILTEL SG-TC1.4-GF Ultra Soft Thermally Conductive Gap Pad

SILTEL SG-TC1.4-GF is an electrically insulating thermally conductive ULTRA Soft silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC1.4-GF demonstrates reliable thermal conductivity packaged with high surface compliance all within an extremely conformable elastomer design. With an extraordinary soft durometer, fluent handling is acheived through the use of a reinforced fiberglass laminate. At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer. SILTEL SG-TC1.4-GF is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC1.4-GF Ultra Soft Features and Benefits
  • Thermal Conductivity - 1.4 W/m-K
  • Ultra Soft Design: 10 (shore 00)
  • Extremely soft and compliable pad design
  • Easy to handle - fiberglass reinforced laminate (GF)
  • Electrically insulating thermal pad solution
  • Excellent gap filling properties
  • Ideal for managing a range of flatness conditions
  • Operates at low pressure
  • High chemical resistance
  • Offers high temperature stability
  • Standard single side tack configuration
  • Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
request samples | data sheet

Material Thickness

  • SG.50-TC1.4-GF (0.50mm)
  • SG1.0-TC1.4-GF (1.00mm)
  • SG2.0-TC1.4-GF (2.00mm)
  • SG3.0-TC1.4-GF (3.00mm)
  • SG5.0-TC1.4-GF (5.00mm)
Format: Ceramic filled silicone pad reinforced with fiberglass laminate on one side

Standard Cross Section

Typical Applications

General Specifications

  • SMD Packages
  • Through Hole Vias
  • Capacitors
  • Heat Pipes
  • Multi-Chip Configurations
  • Interface Gap Management
  • Automotive Electronics
  • Consumer Electronics
  • Medical Electronics
  • Heat Sink | Case Sink
  • Coating: Ceramic filled silicone
  • Support: Fiberglass reinforced laminate (1 side)
  • Operating Temperautre: -40C to 180C
  • Material Color: Red / Brown
  • Gap Pad Surface: Single side light tack only
  • Tack Back Options: None

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Technical Specifications

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC1.4-GF (0.50mm)
Thermal Impedance 7 PSI - 0.890 oC-in^2/W 15 PSI - 0.850 oC-in^2/W 35 PSI - 0.760 oC-in^2/W Dielectric Strength 20 kV/mm
SG1.0-TC1.4-GF (1.00mm)
Thermal Impedance7 PSI - 1.540 oC-in^2/W15 PSI - 1.440 oC-in^2/W35 PSI - 1.260 oC-in^2/W
Dielectric Strength20 kV/mm
SG2.0-TC1.4-GF (2.00mm)
Thermal Impedance7 PSI - 2.310 oC-in^2/W15 PSI - 2.070 oC-in^2/W35 PSI - 1.730 oC-in^2/W
Dielectric Strength20 kV/mm
SG3.0-TC1.4-GF (3.00mm)
Thermal Impedance7 PSI - 3.000 oC-in^2/W15 PSI - 2.630 oC-in^2/W35 PSI - 2.140 oC-in^2/W
Dielectric Strength20 kV/mm
SG5.0-TC1.4-GF (5.00mm)
Thermal Impedance7 PSI - 4.080 oC-in^2/W15 PSI - 3.580 oC-in^2/W35 PSI - 2.730 oC-in^2/W
Dielectric Strength20 kV/mm

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Available Tack Backings
No tack options available Note: standard pad configuration is single side light tack
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use. Shelf life is 2 years from date of manufacture.
Request Sample or Technical Data Sheet
request samples  or technical data sheet