SILTEL SG-TC1.4-GF Ultra Soft Thermally Conductive Gap Pad
- Thermal Conductivity - 1.4 W/m-K
- Ultra Soft Design: 10 (shore 00)
- Extremely soft and compliable pad design
- Easy to handle - fiberglass reinforced laminate (GF)
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard single side tack configuration
- Availabe in sheets or die cuts
Material Thickness
- SG.50-TC1.4-GF (0.50mm)
- SG1.0-TC1.4-GF (1.00mm)
- SG2.0-TC1.4-GF (2.00mm)
- SG3.0-TC1.4-GF (3.00mm)
- SG5.0-TC1.4-GF (5.00mm)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: Fiberglass reinforced laminate (1 side)
- Operating Temperautre: -40C to 180C
- Material Color: Red / Brown
- Gap Pad Surface: Single side light tack only
- Tack Back Options: None
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG.50-TC1.4-GF (0.50mm)
SG1.0-TC1.4-GF (1.00mm)
Dielectric Strength20 kV/mm
SG2.0-TC1.4-GF (2.00mm)
Dielectric Strength20 kV/mm
SG3.0-TC1.4-GF (3.00mm)
Dielectric Strength20 kV/mm
SG5.0-TC1.4-GF (5.00mm)
Dielectric Strength20 kV/mm