SILTEL SG-TC3.2 THERMALLY CONDUCTIVE ULTRA SOFT PAD
SILTEL SG-TC3.2 Ultra Soft Thermally Conductive Gap Pad
SILTEL SG-TC3.2 is an electrically insulating thermally conductive ULTRA Soft silicone gap filler material ideal for use in electronic applications where thermal transfer over large gaps, large tolerances or creating surface contact to multiple device surfaces/heights must be achieved. Due to the specific formulation and ceramic particle filler loading, SG-TC3.2 demonstrates reliable thermal conductivity packaged with high surface compliance all within an extremely conformable elastomer design.
At low pressure, it quickly begins to fill surface gaps which significantly minimizes resistance leading to efficient and reliable heat transfer.
SILTEL SG-TC3.2 is available in sheets or TIMTEL cut parts to match a wide range of industry standard or customer defined outlines.
SILTEL SG-TC3.2 Ultra Soft Features and Benefits
- Thermal Conductivity - 3.2 W/m-K
- Ultra Soft Design: 37 (shore 00)
- Extremely soft and compliable pad design
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard double side tack configuration
- Availabe in sheets or die cuts
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
Material Thickness
- SG.50-TC3.2 (0.50mm)
- SG1.0-TC3.2 (1.00mm)
- SG2.0-TC3.2 (2.00mm)
- SG3.0-TC3.2 (3.00mm)
- SG5.0-TC3.2 (5.00mm)
Format: Unsupported ceramic filled silicone pad
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone
- Support: none
- Operating Temperautre: -40C to 180C
- Material Color: Light Purple
- Gap Pad Surface: Light tack both sides
- Tack Back Options: none
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
Thermal impedance testing performed per ASTM D5470 Test Method. Contact us to request thermal impedance values for specific pressures as well as thermal impedance values for adhesive backed versions.
SG.50-TC3.2 (0.50mm)
Thermal Impedance
10 PSI - 0.290 oC-in^2/W
30 PSI - 0.260 oC-in^2/W
60 PSI - 0.220 oC-in^2/W
Dielectric Strength
15 kV/mm
SG1.0-TC3.2 (1.00mm)
Thermal Impedance10 PSI - 0.490 oC-in^2/W30 PSI - 0.420 oC-in^2/W60 PSI - 0.400 oC-in^2/W
Dielectric Strength15 kV/mm
Dielectric Strength15 kV/mm
SG2.0-TC3.2 (2.00mm)
Thermal Impedance10 PSI - 0.860 oC-in^2/W30 PSI - 0.760 oC-in^2/W60 PSI - 0.680 oC-in^2/W
Dielectric Strength15 kV/mm
Dielectric Strength15 kV/mm
SG3.0-TC3.2 (3.00mm)
Thermal Impedance10 PSI - 1.250 oC-in^2/W30 PSI - 1.030 oC-in^2/W60 PSI - 0.910 oC-in^2/W
Dielectric Strength15 kV/mm
Dielectric Strength15 kV/mm
SG5.0-TC3.2 (5.00mm)
Thermal Impedance10 PSI - 1.610 oC-in^2/W30 PSI - 1.310 oC-in^2/W60 PSI - 1.080 oC-in^2/W
Dielectric Strength15 kV/mm
Dielectric Strength15 kV/mm
Other Information
Material Formats
Sheets
Die cut invidiual pads
Multiple die cut pads per master liner
Available Tack Backings
No additional tack options available
Note: standard pad configuration is double side light natural tack
Storage | Shelf Life
Store material in a cool, dry location at 85F / 29C or below in original packaging until use.
Shelf life is 2 years from date of manufacture.