SILTEL SG-TC7.0 Ultra Soft Thermally Conductive Gap Pad
- Thermal Conductivity - 7.0 W/m-K
- Ultra Soft Design: 55 (shore 00)
- Extremely soft and compliable pad design (putty film type)
- Electrically insulating thermal pad solution
- Excellent gap filling properties
- Ideal for managing a range of flatness conditions
- Operates at low pressure
- High chemical resistance
- Offers high temperature stability
- Standard double side tack configuration
- Availabe in sheets or die cuts
Material Thickness
- SG1.0-TC7.0 (1.00mm)
- SG2.0-TC7.0 (2.00mm)
Standard Cross Section
Typical Applications
General Specifications
- SMD Packages
- Through Hole Vias
- Capacitors
- Heat Pipes
- Multi-Chip Configurations
- Interface Gap Management
- Automotive Electronics
- Consumer Electronics
- Medical Electronics
- Heat Sink | Case Sink
- Coating: Ceramic filled silicone (putty film type)
- Support: none
- Operating Temperautre: -40C to 150C
- Material Color: Gray
- Gap Pad Surface: Light tack both sides
- Tack Back Options: none
Compliance
- RoHs Compliant
- REACH Compliant
- Halogen Free Compliant
Technical Specifications
SG1.0-TC7.0 (1.00mm)
SG2.0-TC7.0 (2.00mm)
Dielectric Strength> 10 kV/mm
Volume Resistivity> 1.0 x 10^12
Dielectric Constant7 @ 1 MHZ